High-performance thermal packaging materials developed successfully

For the heat-generating material of the pre-mixed epoxy resin adhesive used in the electronics industry and the aerospace industry, the basic problem of transportation is that once the heat is generated, it becomes hotter and hotter until the whole is turned into nothing.

In the past, the transportation of such materials required the use of expensive packaging materials and frozen facilities, which were expensive. Recently, Brelt Fine and others have developed materials with good heat dissipation, high heat capacity, and latent heat of fusion. The material is packaged in a plastic bag to avoid evaporation of any material and is sealed in a sandwiched polystyrene container. This method has already applied for a European patent and is expected to have a wide range of applications.