Ube Corporation develops new polyamide copolymer for packaging

At a recent International Packaging Exhibition held in Germany in 2005, Ube Corporation of Japan stated that the company has developed a new generation of polyamide materials using PA6, PA66 and PA12 ternary copolymers, mainly targeting meats, cereals and sausages. Packaging and other thermoformed film applications.

Ube said that the market has been looking for lower melting point film materials to reduce the degradation of ethylene-vinyl alcohol copolymer resin layer in the separator. Due to the lower crystallinity, the new material has a greater elasticity and enables deeper thermoforming processing. Tests on the samples showed that the thermoforming depth of the film made of the new terpolymer material was 30 mm, while those of the film made of PA6/PA12 and PA6/PA66 were 25 mm and 24 mm, respectively. (Tong Quansheng)