Development of Room Temperature Curing High Temperature Adhesive

2.5 Thermogravimetric Analysis of Adhesives

Thermal gravimetric analysis (TGA) of the cured sample of the adhesive is shown in FIG.

As can be seen from Figure 1, the thermal decomposition rate of the adhesive is about 5% at about 350°C, and the thermal decomposition rate rapidly increases when the temperature exceeds 350°C.

2.6 Effect of Curing Time and Curing Temperature on Adhesive Strength

This experiment examined the effect of curing time and curing temperature on the strength of the adhesive, see Table 5.

From Table 5, it can be seen that the adhesive has cured at 25°C for 1 day or 65°C for 1 hour, and the system has been completely cured at a temperature slightly lower than room temperature.

Lower (18°C) curing can still achieve higher strength for 1d.

3 Comprehensive assessment of adhesive properties

3.1 Evaluation of heat aging resistance of adhesives

The adhesive was cured at room temperature for 1d, aged at 200°C for 2000h, and aged at 250°C for 30h. The test shear strength is shown in Table 6.

From Table 6, it can be seen that after the adhesive has been aged at 200°C for 2000 hours and at 250°C for 30 hours, the shear strength is almost not reduced, which shows that the adhesive has excellent heat aging resistance.

(to be continued)